Blackburn Semiconductor advanced packaging process Solutions for advanced IC packaging enable the latest wafer- and panel-level packaging processes and protect key components during intense high-temperature processing methods.

Blackburn provides high performance specialty fluids for heat transfer, cleaning and surface tension reduction to increase throughput, performance and reliability while helping keep costs under control.

Blackburn adhesive products are intended to offer exceptional protection during high-temperature processes and are anticipated to increase efficiency in wafer bumping.

Blackburn help protect your components during shipping and storage to meet your requirements and increase productivity.

The presence of harsh cleaning and etching chemicals, high temperatures and the need to handle ultra pure water, pose fluid handling challenges. Blackburn Fluorothermoplastics are engineered to endure the tough conditions common in chemical delivery systems while maintaining purity and integrity.